The World’s First TSV Dual Stacking TC Bonder
TSV Dual Stacking TC Bonder is high-precision bonding equipment using 3D TSV, the latest semiconductor packaging technology. This product is optimized for production of large capacity memory semiconductors for DRAMs used in ultra-high capacity server (128GB) and latest model smartphones by solving technical problems such as vibrations caused by two bonding heads running simultaneously, thereby allowing doubled productivity, miniaturized equipment, and ultra-precision bonding compared to existing counterparts., equipment miniaturization and ultra-precision bonding.
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