The World’s First TSV Dual Stacking TC Bonder Dual Stacking TC Bonder is high-precision bonding equipment using 3D TSV, the latest semiconductor packaging technology. This product is optimized for production of large capacity memory semiconductors for DRAMs used in ultra-high capacity server (128GB) and latest model smartphones by solving technical problems such as vibrations caused by two bonding heads running simultaneously, thereby allowing doubled productivity, miniaturized equipment, and ultra-precision bonding compared to existing counterparts., equipment miniaturization and ultra-precision bonding. | Blog Magazine of Korean products, brands and Goods